Semiconductor power losses are dissipated in the form of heat, which must be transferred away from the switching junction, if efficient switching is to be maintained. The reliability and life expectancy of any power semiconductor are directly related to the maximum device junction temperature experienced. It is therefore essential that the thermal design determine accurately the maximum junction temperature from the device power dissipation. Every 10°C junction temperature decrease, doubles device lifetime.
پسورد : 4power
سرچشمه: مهندسی تکنولوژی برق
